Deposition & Etch Equipment Production Engineer

About the role

Join the Cleanroom Operations team at a newly built facility in Aubervilliers, dedicated to the fabrication of superconducting quantum devices. As a Tool Owner and hands‑on production engineer you will be responsible for the deposition and etch equipment that underpins the weekly wafer output of the quantum computer program.

Key responsibilities

• Ensure uptime, preventive maintenance, first‑level troubleshooting and spare management for assigned deposition and etch tools.
• Translate the weekly wafer launch plan into detailed tool‑level schedules, balancing maintenance, qualification runs and operator availability.
• Run qualified recipes on experimental and test wafers, monitor performance, and escalate any deviation to Process Development Engineering.
• Write, maintain and improve SOPs, and train technicians together with the Process Owner.
• Identify and remove bottlenecks, track KPIs and contribute to capacity modelling and ramp planning.
• Apply cleanroom, chemical handling and equipment safety rules, and support risk assessments for unattended operation.

Required profile

• 3+ years hands‑on experience in a semiconductor cleanroom, pilot line or micro/nanofabrication facility.
• Direct experience operating and maintaining process equipment, including preventive maintenance and supplier coordination.
• Hands‑on command of at least one of: UHV sputtering/deposition, metal evaporation (shadow‑angle), or plasma etching (ICP‑RIE).
• Solid grounding in semiconductor unit processes, vacuum systems and their maintenance.
• Comfort with production data tools (MES, spreadsheets) and basic statistical analysis.
• Experience building load plans, writing SOPs and training operators.
• Ownership mindset with the ability to stop a run and communicate issues early.
• Master’s or engineering degree in microelectronics, materials science, physics or equivalent experience; fluent English.

Required skills

• UHV sputtering and deposition systems (cryogenic pumping, chamber/source maintenance).
• Metal evaporation, including shadow‑angle techniques.
• Plasma etching (ICP‑RIE) with endpoint detection and etch‑rate monitoring.
• Vacuum system maintenance and troubleshooting.
• MES data handling, spreadsheet analysis and basic statistics.
• SOP authoring and operator training.
• Load planning and KPI tracking.