3D Integration Engineer – Quantum Hardware

About the role

Alice & Bob is developing the first universal, fault‑tolerant quantum computer based on superconducting Schrödinger cat qubits. As a member of the Process Integration team, you will turn cutting‑edge QPU designs into physical reality, bridging nanofabrication, assembly and scalable 3D integration.

Key responsibilities

• Explore, identify and benchmark promising 3D assembly technologies for QPUs, evaluating material and process compatibility, microwave performance and cryogenic reliability.
• Develop and qualify core 3D integration building blocks such as airbridges, flip‑chip bonding, TSVs, multi‑layer wiring, superconducting interconnects and wafer‑level assembly, in close collaboration with fabrication and packaging teams.
• Design and drive integration test plans together with cross‑functional groups.
• Build scalable, well‑documented integration procedures to support company growth.
• Investigate integration issues and technical anomalies, trace root causes and ensure alignment with specifications and performance targets.
• Act as the primary technical liaison for 3D integration with external foundries, packaging partners and equipment vendors, working alongside the foundry partnerships expert.

Required profile

• PhD or MSc in physics, materials science, electrical engineering or microelectronics with strong hands‑on cleanroom experience.
• Minimum 3 years of proven 3D integration experience, including flip‑chip/bump bonding and TSV processing.
• Demonstrated ability to develop and qualify an integration process brick end‑to‑end, from literature survey and test‑vehicle design through experiments, data analysis and go/no‑go decision.
• Solid grounding in failure analysis and reliability assessment of 3D interconnects using cross‑sectioning, SEM, X‑ray inspection/tomography, profilometry and electrical test structures.
• Knowledge of superconducting QPU fabrication and cryogenic operation requirements is a plus.