Senior Packaging Engineer

About the role

Arago is seeking a Senior Packaging Engineer to lead integrated circuit (IC) packaging projects from concept through manufacturing. Based in Paris, you will drive the design, supplier selection, and ramp‑up of cutting‑edge semiconductor and photonic devices.

Key responsibilities

• Design and simulate packaging solutions, covering drawings, DFM and thermal/mechanical/EM analysis.
• Identify, qualify, and manage external sub‑contractors for packaging processes.
• Collaborate with IC design, optics, and PCB teams to align specifications across domains.
• Lead industrialization, ensuring high yield, Cpk and smooth NPI ramp‑up.
• Perform failure analysis, debugging and continuous improvement using Six Sigma methods.

Required profile

• Master's degree in Electrical Engineering or Integrated Circuits Design.
• 5+ years in semiconductor and photonic packaging.
• Proficiency in English; French is a plus.

Required skills

• Wafer dicing (stealth, blade, diamond scribing).
• High‑density Cu pillars, advanced bumping, flip‑chip, redistribution layer.
• Encapsulation methods (thermal lid, compression molding, glob‑top).
• Die‑attach and bonding (epoxy, attach film, reflow, thermocompression, eutectic, laser‑assisted, Cu‑Cu direct).
• Wirebonding and 2.5D/3D integration (back grinding, TSV reveal, die stacking, interposer).
• Photonic and optoelectronic packaging, micro‑scale optical alignment, passive/active lens and fiber alignment, fine die placement (<1 µm), InP, GaAs and other non‑Si semiconductors.
• Thermal, mechanical and EM simulation.
• Packaging industrialization, high‑yield manufacturing, failure analysis, Six Sigma methodology.